Nom du produit:1,3-Dioxo-1H-benzo[de]isoquinolin-2(3H)-yl trifluoromethanesulfonate

IUPAC Name:2,4-dioxo-3-azatricyclo[7.3.1.0⁵,¹³]trideca-1(13),5,7,9,11-pentaen-3-yl trifluoromethanesulfonate

CAS:85342-62-7
Formule moléculaire:C13H6F3NO5S
Pureté:97%
Numéro de catalogue:CM229412
Poids moléculaire:345.25

Unité d'emballage Stock disponible Prix($) Quantité
CM229412-5g in stock ȌǕ
CM229412-10g in stock ƻȦȷ
CM229412-25g in stock Ʊſƻ

Pour une utilisation en R&D uniquement..

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Détails du produit

N° CAS:85342-62-7
Formule moléculaire:C13H6F3NO5S
Point de fusion:-
Code SMILES:O=S(C(F)(F)F)(ON(C(C1=CC=CC2=CC=CC3=C12)=O)C3=O)=O
Densité:
Numéro de catalogue:CM229412
Poids moléculaire:345.25
Point d'ébullition:
N° Mdl:MFCD02683478
Stockage:Store at 2-8°C.

Category Infos

Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.

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