Nom du produit:4THBP

IUPAC Name:4-(4-hydroxybenzoyl)benzene-1,2,3-triol

CAS:31127-54-5
Formule moléculaire:C13H10O5
Pureté:97%
Numéro de catalogue:CM117216
Poids moléculaire:246.22

Unité d'emballage Stock disponible Prix($) Quantité
CM117216-100g in stock ǸŽ
CM117216-500g in stock Žǟƴ

Pour une utilisation en R&D uniquement..

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Détails du produit

N° CAS:31127-54-5
Formule moléculaire:C13H10O5
Point de fusion:-
Code SMILES:O=C(C1=CC=C(O)C=C1)C2=CC=C(O)C(O)=C2O
Densité:
Numéro de catalogue:CM117216
Poids moléculaire:246.22
Point d'ébullition:519°C at 760 mmHg
N° Mdl:MFCD00083097
Stockage:Store at 2-8°C.

Category Infos

Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.

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