cas 110726-28-8|| where to buy 4,4'-(1-(4-(2-(4-Hydroxyphenyl)propan-2-yl)phenyl)ethane-1,1-diyl)diphenol

Nom du produit:4,4'-(1-(4-(2-(4-Hydroxyphenyl)propan-2-yl)phenyl)ethane-1,1-diyl)diphenol

IUPAC Name:4-(2-{4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl}propan-2-yl)phenol

Unité d'emballage	Stock disponible	Prix($)
CM247724-25g	in stock	ȡǶ
CM247724-100g	in stock	ƥȐȺ

Pour une utilisation en R&D uniquement..

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: N° CAS:110726-28-8; Formule moléculaire:C29H28O3; Point de fusion:-; Code SMILES:CC(C)(C1=CC=C(O)C=C1)C1=CC=C(C=C1)C(C)(C1=CC=C(O)C=C1)C1=CC=C(O)C=C1; Densité:

: Numéro de catalogue:CM247724; Poids moléculaire:424.54; Point d'ébullition:623.1°C at 760 mmHg; N° Mdl:MFCD00191685; Stockage:Store at room temperature.

: Photoresist; Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.